Semiconductor Wafer Lapping Machine Outer Bearing Race from China
Outer race optimized for cylindrical roller bearings in lapping machines that achieve ultra-flat wafer surfaces for semiconductor device fabrication. Withstands abrasive slurry conditions while maintaining sub-micron precision. HTS 8482.99.2560 applies to such other cylindrical roller bearing outer rings.
Duty Rate — China → United States
40.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document corrosion resistance for slurry environments to support semiconductor processing classification
• Provide equipment OEM specifications linking race to identified wafer lapping apparatus
• Ensure no pre-installation; loose races classify separately from assembled bearings