Precision Inner Race for Wafer Grinder Cylindrical Roller Bearings from Japan
High-precision inner ring for cylindrical roller bearings in wafer grinders that shape crystal boules to exact diameters for semiconductor wafer production. Features super-fine surface finish to maintain grinding accuracy and flatness. Classified in 8482.99.2560 for other cylindrical roller bearing inner races.
Duty Rate — Japan → United States
15.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include surface finish specifications (Ra values) in documentation to justify precision bearing classification
• Avoid bulk packaging declarations; specify retail-for-equipment use to prevent parts tariff shifts
• Certify compatibility with Czochralski crystal processing equipment per statistical notes