High-Precision Wafer Polisher Roller Bearing Outer Race from China
Ultra-precision outer ring for cylindrical roller bearings in chemical-mechanical wafer polishers achieving mirror-finish surfaces for semiconductor fabrication. Designed for high-speed, low-vibration polishing platens. Classified 8482.99.2560 for other cylindrical roller bearing outer rings.
Duty Rate — China → United States
40.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Specify polishing tolerances (e.g
• <1nm roughness) to justify precision classification
• Provide CMP (chemical mechanical polishing) equipment compatibility certification
• Avoid classification as polishing machine parts (8464) by emphasizing bearing function