Grade 3 Tungsten Carbide Balls
Ultra-precision Grade 3 tungsten carbide balls (0.08μm sphericity) for bearings in high-RPM wafer slicing saws. Essential for maintaining cut parallelism in semiconductor wafers. HTS 8482.91.0090 other balls.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If marketed as diamond grinding tool inserts
Carbide balls for tooling classify under Chapter 82 tool plates.
If parts of semiconductor boule slicing saws
Machine-specific saw parts under Chapter 84.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Provide Grade 3 deviation certificates; comply with conflict minerals reporting for tungsten; use carbide-specific handling equipment
Related Products under HTS 8482.91.00.90
Grade 5 Silicon Steel Bearing Balls
Grade 5 precision silicon-alloyed steel balls for bearings in Czochralski crystal puller rotation mechanisms. Critical for maintaining boule uniformity during semiconductor crystal growth. HTS 8482.91.0090 as other bearing balls.
Precision Chrome Steel Bearing Balls
High-precision chrome steel balls used as rolling elements in ball bearings for semiconductor wafer grinders and polishers. These balls ensure smooth rotation and minimal friction during the grinding process to achieve flatness tolerances on semiconductor wafers. Classified under 8482.91.0090 as 'other' balls for bearing parts, distinct from needles or standard rollers.
Ceramic Silicon Nitride Bearing Balls
Non-corrodible silicon nitride ceramic balls for high-speed bearings in crystal grinders used in semiconductor boule preparation. These balls provide superior wear resistance and low thermal expansion for precise diameter grinding. Falls under HTS 8482.91.0090 as 'other' bearing balls.
Tungsten Carbide Bearing Rollers
Small tungsten carbide cylindrical rollers for precision roller bearings in wafer slicing saw spindles. These provide extreme hardness for high-speed cutting of monocrystalline semiconductor boules. Classified as 'other' rollers under 8482.91.0090 for bearing parts.
Miniature Needle Rollers for Wafer Polishers
Thin miniature needle rollers (under 1.0mm diameter) for ultra-precision bearings in semiconductor wafer polishers. Enable nanometer-level surface flatness preparation for fabrication. Though needles, classified under 'other' 8482.91.0090 when not matching specific needle provisions.
Hybrid Ceramic-Steel Bearing Balls
Hybrid balls with ceramic core and thin steel coating for bearings in float zone crystal growers. Combine ceramic purity with steel durability for semiconductor processing. HTS 8482.91.0090 as other bearing balls.