Precision Ground Spherical Roller for Semiconductor Equipment from Mexico
Ultra-precision spherical roller with micro-tolerances for bearings in semiconductor wafer grinding and polishing machines. Ground to sub-micron flatness for vibration-free operation during wafer processing. HTS 8482.91.0070 applies as a bearing part used in high-tech manufacturing.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide equipment end-use letters from buyers to support semiconductor application claims
• Include SEMI standards certification for cleanroom compatibility documentation