Precision Ground Spherical Roller for Semiconductor Equipment from Japan
Ultra-precision spherical roller with micro-tolerances for bearings in semiconductor wafer grinding and polishing machines. Ground to sub-micron flatness for vibration-free operation during wafer processing. HTS 8482.91.0070 applies as a bearing part used in high-tech manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide equipment end-use letters from buyers to support semiconductor application claims
• Include SEMI standards certification for cleanroom compatibility documentation