Precision Ground Spherical Roller for Semiconductor Equipment from Germany
Ultra-precision spherical roller with micro-tolerances for bearings in semiconductor wafer grinding and polishing machines. Ground to sub-micron flatness for vibration-free operation during wafer processing. HTS 8482.91.0070 applies as a bearing part used in high-tech manufacturing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide equipment end-use letters from buyers to support semiconductor application claims
• Include SEMI standards certification for cleanroom compatibility documentation