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8482.91.00.50/Custom Tapered Roller for Wafer Lapping Machine/Japan

Custom Tapered Roller for Wafer Lapping Machine from Japan

Custom-ground tapered rollers for maintaining flatness in semiconductor wafer lapping/polishing equipment. HTS 8482.91.0050 when imported as separate bearing rollers.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Flatness specification (bow <1μm); lapping compound compatibility; matched set numbering