High-Purity Copper Balls for Wafer Lapping Machine Thrust Bearings from Japan
Ultra-pure copper alloy balls for thrust bearings in wafer lappers that achieve flatness tolerances critical for semiconductor fabrication. Classified HTS 8482.91.0015 per statistical note 6 for copper balls in wafer preparation equipment. Provides contamination-free load distribution during lapping.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Require particle count certification (<10 particles >0.5μm)
• Submit lapping machine blueprints showing bearing placement
• Monitor for oxidation—specify inert atmosphere packaging