High-Purity Copper Balls for Wafer Lapping Machine Thrust Bearings from China

Ultra-pure copper alloy balls for thrust bearings in wafer lappers that achieve flatness tolerances critical for semiconductor fabrication. Classified HTS 8482.91.0015 per statistical note 6 for copper balls in wafer preparation equipment. Provides contamination-free load distribution during lapping.

Duty Rate — China → United States

39.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

Import Tips

Require particle count certification (<10 particles >0.5μm)

Submit lapping machine blueprints showing bearing placement

Monitor for oxidation—specify inert atmosphere packaging