Copper Roller Balls for Semiconductor Wafer Polisher Spindles from Japan
Precision copper alloy roller balls for high-speed polishers that prepare wafer surfaces to atomic flatness for semiconductor device fabrication. HTS 8482.91.0015 designation via statistical note 6 for copper balls in wafer polishing equipment. Critical for nanometer-level surface finish control.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide surface roughness specifications (Ra <0.1nm capability)
• Include polisher slurry compatibility certification
• Ensure ESD-safe handling protocols in shipping