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8482.91.00.15/Copper Roller Balls for Semiconductor Wafer Polisher Spindles/Japan

Copper Roller Balls for Semiconductor Wafer Polisher Spindles from Japan

Precision copper alloy roller balls for high-speed polishers that prepare wafer surfaces to atomic flatness for semiconductor device fabrication. HTS 8482.91.0015 designation via statistical note 6 for copper balls in wafer polishing equipment. Critical for nanometer-level surface finish control.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Provide surface roughness specifications (Ra <0.1nm capability)

• Include polisher slurry compatibility certification

• Ensure ESD-safe handling protocols in shipping

Copper Roller Balls for Semiconductor Wafer Polisher Spindles from Japan — Import Duty Rate | HTS 8482.91.00.15