Copper Roller Balls for Semiconductor Wafer Polisher Spindles from China
Precision copper alloy roller balls for high-speed polishers that prepare wafer surfaces to atomic flatness for semiconductor device fabrication. HTS 8482.91.0015 designation via statistical note 6 for copper balls in wafer polishing equipment. Critical for nanometer-level surface finish control.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide surface roughness specifications (Ra <0.1nm capability)
• Include polisher slurry compatibility certification
• Ensure ESD-safe handling protocols in shipping