Copper Alloy Balls for Wafer Slicing Saw Bearings from Japan
Specialized copper balls for precision bearings in inner diameter (ID) saws that slice semiconductor wafers from monocrystalline boules. Falls under HTS 8482.91.0015 as statistical note 6 copper alloy balls for wafer slicing equipment in semiconductor processing. Ensures vibration-free slicing for uniform wafer thickness.
Duty Rate — Japan → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document saw blade specifications showing required RPM tolerance for bearing selection
• Include material safety data confirming low particle generation
• Ensure traceability from boule to wafer process documentation