Copper Alloy Balls for Wafer Slicing Saw Bearings from Germany
Specialized copper balls for precision bearings in inner diameter (ID) saws that slice semiconductor wafers from monocrystalline boules. Falls under HTS 8482.91.0015 as statistical note 6 copper alloy balls for wafer slicing equipment in semiconductor processing. Ensures vibration-free slicing for uniform wafer thickness.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document saw blade specifications showing required RPM tolerance for bearing selection
• Include material safety data confirming low particle generation
• Ensure traceability from boule to wafer process documentation