Copper Alloy Balls for Wafer Slicing Saw Bearings from Germany
Specialized copper balls for precision bearings in inner diameter (ID) saws that slice semiconductor wafers from monocrystalline boules. Falls under HTS 8482.91.0015 as statistical note 6 copper alloy balls for wafer slicing equipment in semiconductor processing. Ensures vibration-free slicing for uniform wafer thickness.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document saw blade specifications showing required RPM tolerance for bearing selection
• Include material safety data confirming low particle generation
• Ensure traceability from boule to wafer process documentation