Stainless Alloy Steel Balls for Wafer Slicing Saw Bearings from Japan
Corrosion-resistant stainless alloy steel balls for the high-precision bearings in wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. Designed for ultra-low vibration to maintain cut accuracy within microns. HTS 8482.91.0010 covers these alloy steel bearing balls.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include bearing assembly drawings showing ball integration to distinguish from loose steel balls
• Certify compliance with ISO 3290 precision ball standards (Grade 3-10 typical for wafer equipment)
• For high-volume imports, consider binding rulings on alloy composition thresholds