Wafer Grinder Spindle Bearing from Japan
Custom spindle bearing assembly for semiconductor crystal grinders, grinding boules to wafer diameters with flat indicators. Under HTS 8482.80.00.80 as other bearing for statistical note (a)(ii)(A) equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include spindle RPM/load specs matching grinder functions
• Use 'other' subheading justification via process description