</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8482.80.00.80/Wafer Grinder Spindle Bearing/Japan

Wafer Grinder Spindle Bearing from Japan

Custom spindle bearing assembly for semiconductor crystal grinders, grinding boules to wafer diameters with flat indicators. Under HTS 8482.80.00.80 as other bearing for statistical note (a)(ii)(A) equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Include spindle RPM/load specs matching grinder functions

• Use 'other' subheading justification via process description