Precision Angular Contact Ball Bearing from Japan
A high-precision angular contact ball bearing designed for semiconductor wafer grinding machines, capable of handling both radial and axial loads at high speeds. It falls under HTS 8482.80.00.80 as an other ball bearing not specified elsewhere in heading 8482. This subheading covers specialized bearings used in precision machinery like semiconductor processing equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Verify bearing specifications match semiconductor equipment use via manufacturer certifications to avoid reclassification
• Include detailed engineering drawings and end-use statements in documentation to confirm 'other' status under 8482.80
• Watch for common pitfalls like incorrect dynamic load ratings leading to classification in precision bearing subheadings