Miniature Four-Point Contact Bearing from Japan
Miniature four-point contact ball bearing for precision wafer polishers, accommodating radial/axial/bidirectional loads in flatness-critical semiconductor surfacing. HTS 8482.80.00.80 covers such other specialized ball bearings for wafer prep equipment.
Duty Rate — Japan → United States
15.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide micrometer-level tolerance specs linking to polisher flatness requirements
• Document as semiconductor-specific to distinguish from general miniature bearings