Miniature Four-Point Contact Bearing from Japan
Miniature four-point contact ball bearing for precision wafer polishers, accommodating radial/axial/bidirectional loads in flatness-critical semiconductor surfacing. HTS 8482.80.00.80 covers such other specialized ball bearings for wafer prep equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide micrometer-level tolerance specs linking to polisher flatness requirements
• Document as semiconductor-specific to distinguish from general miniature bearings