Miniature Four-Point Contact Bearing from Japan
Miniature four-point contact ball bearing for precision wafer polishers, accommodating radial/axial/bidirectional loads in flatness-critical semiconductor surfacing. HTS 8482.80.00.80 covers such other specialized ball bearings for wafer prep equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide micrometer-level tolerance specs linking to polisher flatness requirements
• Document as semiconductor-specific to distinguish from general miniature bearings