Corrosion-Resistant Combined Ball/Roller Bearing from Japan
Combined ball/roller bearing with PVD coatings for corrosive semiconductor etching-adjacent grinders, used in wafer slicing and grinding stages. Fits HTS 8482.80.00.80 as other combined bearings for semiconductor material processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include coating specs (e.g
• DLC/PVD) and chemical resistance tests
• Specify boule slicing/grinding role in commercial invoices