Corrosion-Resistant Combined Ball/Roller Bearing from Japan
Combined ball/roller bearing with PVD coatings for corrosive semiconductor etching-adjacent grinders, used in wafer slicing and grinding stages. Fits HTS 8482.80.00.80 as other combined bearings for semiconductor material processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include coating specs (e.g
• DLC/PVD) and chemical resistance tests
• Specify boule slicing/grinding role in commercial invoices