FAG 7208 B-MP Angular Contact Ball and Cylindrical Roller Bearing from Mexico
This high-performance combined bearing supports axial and radial forces in wafer lapping/polishing equipment, critical for flatness in semiconductor wafers. Falls under HTS 8482.80.00.60 for combined ball/cylindrical roller types. Optimized for cleanroom environments in chip fabrication.
Duty Rate — Mexico → United States
15.8%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify grease/lubricant type for cleanroom compatibility to support classification
• Use precise model numbers in entries to match statistical suffix .60