FAG 7208 B-MP Angular Contact Ball and Cylindrical Roller Bearing from Japan
This high-performance combined bearing supports axial and radial forces in wafer lapping/polishing equipment, critical for flatness in semiconductor wafers. Falls under HTS 8482.80.00.60 for combined ball/cylindrical roller types. Optimized for cleanroom environments in chip fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify grease/lubricant type for cleanroom compatibility to support classification
• Use precise model numbers in entries to match statistical suffix .60