FAG 7208 B-MP Angular Contact Ball and Cylindrical Roller Bearing from Japan
This high-performance combined bearing supports axial and radial forces in wafer lapping/polishing equipment, critical for flatness in semiconductor wafers. Falls under HTS 8482.80.00.60 for combined ball/cylindrical roller types. Optimized for cleanroom environments in chip fabrication.
Duty Rate — Japan → United States
15.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify grease/lubricant type for cleanroom compatibility to support classification
• Use precise model numbers in entries to match statistical suffix .60