FAG 7208 B-MP Angular Contact Ball and Cylindrical Roller Bearing from China
This high-performance combined bearing supports axial and radial forces in wafer lapping/polishing equipment, critical for flatness in semiconductor wafers. Falls under HTS 8482.80.00.60 for combined ball/cylindrical roller types. Optimized for cleanroom environments in chip fabrication.
Duty Rate — China → United States
40.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Certify grease/lubricant type for cleanroom compatibility to support classification
• Use precise model numbers in entries to match statistical suffix .60