Flanged Miniature Ball Bearing from Japan
Stainless steel flanged miniature ball bearing for mounting wafer lapping equipment in semiconductor processing lines. HTS 8482.10.50 as other ball bearing despite flange feature not matching prior specifics. Ensures precise alignment during wafer surface preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include CAD drawings showing flange integration to prevent parts classification
• Verify corrosion resistance specs for cleanroom validation
• Avoid pitfall of automotive classification triggering higher duties