Ceramic Hybrid Ball Bearing from Japan
Ceramic hybrid ball bearing with steel races and ceramic balls for wafer polishers in semiconductor fabrication prep, providing superior wear resistance and minimal particle generation. Falls under HTS 8482.10.50 as other ball bearings. Critical for achieving flatness tolerances on wafer surfaces.
Duty Rate — Japan → United States
19%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify ceramic content and cleanroom compatibility in import docs; critical for classification justification
• Obtain material test reports to avoid reclassification as plastic bearings
• Common issue: undervaluation due to hybrid construction