Miniature Radial Ball Bearing for Wafer Grinding Machines from China
Miniature radial ball bearing optimized for crystal grinders that shape semiconductor boules to exact diameters and flats. Classified under HTS 8482.10.5064 for other radial ball bearings. Features corrosion-resistant coatings for harsh chemical environments in wafer preparation.
Duty Rate — China → United States
44%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide dimensional tolerance certificates (e.g
• ISO 286) critical for boule grinding precision
• Label with 'semiconductor grade' to distinguish from general industrial bearings during customs review
• Avoid common pitfall of missing RoHS compliance docs for electronics manufacturing imports