Thin Section Angular Contact 61808 from Japan
Thin-section 61808 (40x52x7mm) angular contact bearing minimizes space in compact wafer grinders for semiconductor flats indication. Low profile supports precision grinding per statistical note. Classified HTS 8482.10.5028.
Duty Rate — Japan → United States
19%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Measure section thickness for thin-section verification; provide cross-section diagrams
• Avoid classification as plain under 8482.10.5012
• Cleanroom packaging required