Unground Angular Contact Ball Bearings for Wafer Grinders from Mexico
These unground angular contact ball bearings handle axial and radial loads in wafer grinders that shape crystal boules to precise diameters for semiconductor wafer production. HTS 8482.10.50.04 applies to their unfinished surface condition prior to final polishing. Critical for achieving flatness tolerances in wafer preparation equipment.
Duty Rate — Mexico → United States
34%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document load ratings and contact angles specific to grinding applications to support semiconductor equipment classification
• Pair with commercial invoices specifying 'unground' to avoid automatic classification as finished goods