Unground Angular Contact Ball Bearings for Wafer Grinders from China
These unground angular contact ball bearings handle axial and radial loads in wafer grinders that shape crystal boules to precise diameters for semiconductor wafer production. HTS 8482.10.50.04 applies to their unfinished surface condition prior to final polishing. Critical for achieving flatness tolerances in wafer preparation equipment.
Duty Rate — China → United States
44%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document load ratings and contact angles specific to grinding applications to support semiconductor equipment classification
• Pair with commercial invoices specifying 'unground' to avoid automatic classification as finished goods