Preliminary Silicon Nitride Ball Bearings for Wafer Polishers from Japan
Unground ceramic silicon nitride ball bearings for wafer polishers that achieve mirror finishes on semiconductor wafers before fabrication. Classified as unground bearings under HTS 8482.10.50.04 despite advanced material, due to unfinished surface processing. Enable contamination-free polishing critical for device yield.
Duty Rate — Japan → United States
34%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Ceramic material certificates required; verify no metal contamination per semiconductor cleanroom standards
• Specify surface roughness values (>1.6 μm Ra) in technical data sheets for unground verification
• Watch for reclassification to Chapter 69 if imported in bulk ceramic form rather than bearing assemblies