Semiconductor Wafer Grinder Spindle Bearing with Integral Shaft from Japan
Specialized ball bearing with integral shaft for spindles in semiconductor wafer grinders, ensuring ultra-flat surfaces for chip fabrication. Under HTS 8482.10.10 as a ball bearing with integral shaft, but note statistical notes for semi equipment. Critical for crystal boule processing.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.94.4315%Parts of passenger vehicles and light trucks that are products of Japan as provided for in subdivision (l) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent as provided for in subdivision (m) of U.S. note 33 to this subchapter.
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
9903.74.110%Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
Import Tips
• Reference statistical note (a)(ii)(C) for wafer grinders in documentation to support semiconductor end-use
• Provide cleanroom compatibility certifications (e.g
• low particle generation) for customs validation
• Declare vacuum-compatible materials if applicable to avoid reclassification as Chapter 90 apparatus