Brass Wafer Lapping Machine Slurry Valve Body from Mexico
Precision brass valve body controlling abrasive slurry flow in wafer lappers and polishers that achieve flatness tolerances for semiconductor fabrication. Falls under HTS 8481.90.9060 as a valve body for semiconductor wafer preparation equipment. Ensures uniform polishing critical for device processing readiness.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document RoHS compliance for brass alloys used in cleanroom semiconductor environments
• Include flow rate specifications matching lapping equipment tolerances