Wafer Polisher Slurry Delivery Valve from China
Diaphragm valve for precise slurry delivery in chemical mechanical planarization (CMP) polishers preparing wafer surfaces for fabrication. Under HTS 8481.80.9050 as other semiconductor wafer prep appliance. Prevents agglomeration in nano-scale polishing.
Duty Rate — China → United States
39.5%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Include CMP polisher pad/conditioner compatibility statements
• Document slurry chemistry (e.g
• ceria-based) for process specificity
• Ensure no copper contamination claims for logic fab use