8481.80.90.50/Wafer Lapping Machine Pressure Valve/Japan

Wafer Lapping Machine Pressure Valve from Japan

Hydraulic pressure regulating valve for maintaining consistent force in double-side wafer lappers achieving dimensional tolerances. Classified in HTS 8481.80.9050 for semiconductor wafer preparation appliances. Ensures parallelism within microns.

Duty Rate — Japan → United States

12%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Document target thickness tolerances (e.g

• ±0.5μm) linking to lapping

• Include hydraulic fluid specs for semiconductor cleanroom approval

• Avoid general 'hydraulic valve' description to prevent 8412 classification