Wafer Grinder Coolant Control Valve

Precision solenoid valve for metering diamond slurry coolant in wafer grinding and lapping machines during semiconductor wafer preparation. HTS 8481.80.9050 covers such other appliances in wafer prep equipment pipelines. Features low-particle generation for flatness-critical processes.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China2%+35.0%37%
🇲🇽Mexico2%+10.0%12%
🇨🇦Canada2%+10.0%12%
🇩🇪Germany2%+10.0%12%
🇯🇵Japan2%+10.0%12%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8481.80.90Same rate: 37%

If for ion implanters or diffusion furnaces

Dedicated subheading for valves in specific semiconductor processing tools.

8413.91.90Lower: 35% vs 37%

If component of complete pump assembly

Valves integral to semiconductor coolant pumps classify with the pump in 8413.

9031.80.80Lower: 35% vs 37%

If with built-in flow measurement

Measuring/control valves combining valve + sensor functions go to Chapter 90.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Label with exact tolerances (e.g

<0.1um particle size) to support semiconductor classification

Pair with wafer grinder invoices to demonstrate process-specific use

Avoid misclassification by specifying 'not for general plumbing' in entry docs

Related Products under HTS 8481.80.90.50

Wafer Polisher Slurry Delivery Valve

Diaphragm valve for precise slurry delivery in chemical mechanical planarization (CMP) polishers preparing wafer surfaces for fabrication. Under HTS 8481.80.9050 as other semiconductor wafer prep appliance. Prevents agglomeration in nano-scale polishing.

Ion Implanter Process Gas Isolation Valve

Fast-acting isolation valve for dopant gas lines in high-energy ion implanters used after wafer preparation. HTS 8481.80.9050 covers other valves in semiconductor processing equipment. Millisecond response prevents source contamination.

Wafer Lapping Machine Pressure Valve

Hydraulic pressure regulating valve for maintaining consistent force in double-side wafer lappers achieving dimensional tolerances. Classified in HTS 8481.80.9050 for semiconductor wafer preparation appliances. Ensures parallelism within microns.

Epitaxial Reactor Precursor Gas Valve

UHP precursor gas delivery valve for MOCVD epitaxial reactors growing compound semiconductor layers on prepared wafers. HTS 8481.80.9050 for other semiconductor processing appliances. Heated design prevents condensation.

Crystal Boule Diameter Grinder Coolant Valve

Metering valve controlling coolant to diamond wheels grinding semiconductor crystal boules to exact wafer diameters. Under HTS 8481.80.9050 as wafer manufacturing preparation appliance. Critical for slicing yield.

Wafer Flatness Polisher Vacuum Valve

Vacuum chuck control valve maintaining wafer hold-down during back-side polishing for ultimate flatness in semiconductor processing. HTS 8481.80.9050 other appliance for wafer polishers. Sub-micron flatness capability.