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Wafer Flatness Polisher Vacuum Valve from Japan

Vacuum chuck control valve maintaining wafer hold-down during back-side polishing for ultimate flatness in semiconductor processing. HTS 8481.80.9050 other appliance for wafer polishers. Sub-micron flatness capability.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

Specify flatness specs (e.g

<10nm PV) linking to polishers

Include vacuum level range (10-5 to atm) documentation

Prove not general vacuum valve via fab end-use letters