Wafer Flatness Polisher Vacuum Valve from China
Vacuum chuck control valve maintaining wafer hold-down during back-side polishing for ultimate flatness in semiconductor processing. HTS 8481.80.9050 other appliance for wafer polishers. Sub-micron flatness capability.
Duty Rate — China → United States
39.5%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Specify flatness specs (e.g
• <10nm PV) linking to polishers
• Include vacuum level range (10-5 to atm) documentation
• Prove not general vacuum valve via fab end-use letters