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8481.80.90.50/Semiconductor Wafer Edge Grinder Water Valve/Japan

Semiconductor Wafer Edge Grinder Water Valve from Japan

Precision water control valve for edge grinding stations removing damaged crystal layer post-slicing/polishing. HTS 8481.80.9050 for wafer preparation equipment appliances. Prevents chipping for yield improvement.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify edge profile geometries supported (laser diced compatible)

• Include DI water resistivity specs for process purity

• Link to full wafer prep sequence documentation

Semiconductor Wafer Edge Grinder Water Valve from Japan — Import Duty Rate | HTS 8481.80.90.50