Thermoregulating Valve for Wafer Lapping Machine Coolant from Japan
Self-operating valve maintains lapping slurry temperature for achieving wafer flatness tolerances <1µm. Classified under HTS 8481.80.9015 for temperature control in semiconductor wafer preparation lapping equipment. Prevents thermal distortion during precision surface preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify temperature stability (±0.1°C) required for lapping process control
• Document use in single/dual wafer lappers for classification support