Thermoregulating Valve for Wafer Lapping Machine Coolant from Japan
Self-operating valve maintains lapping slurry temperature for achieving wafer flatness tolerances <1µm. Classified under HTS 8481.80.9015 for temperature control in semiconductor wafer preparation lapping equipment. Prevents thermal distortion during precision surface preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify temperature stability (±0.1°C) required for lapping process control
• Document use in single/dual wafer lappers for classification support