8481.80.90.15/Temperature Regulator Valve for Wafer Slicing Coolant System/Germany

Temperature Regulator Valve for Wafer Slicing Coolant System from Germany

Self-operating thermostatic valve controls coolant temperature during diamond wafer slicing from silicon boules. Classified HTS 8481.80.9015 for temperature regulation in semiconductor wafer preparation saw equipment. Maintains optimal cutting conditions for minimal thermal damage.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Specify temperature regulation range (e.g

• 15-25°C) suitable for wafer slicing processes

• Include cleanroom compatibility documentation (ISO Class 1-3)

• Avoid 'HVAC valve' declarations that trigger 8415.xx classifications