Temperature Regulator Valve for Wafer Slicing Coolant System from China
Self-operating thermostatic valve controls coolant temperature during diamond wafer slicing from silicon boules. Classified HTS 8481.80.9015 for temperature regulation in semiconductor wafer preparation saw equipment. Maintains optimal cutting conditions for minimal thermal damage.
Duty Rate — China → United States
39.5%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Specify temperature regulation range (e.g
• 15-25°C) suitable for wafer slicing processes
• Include cleanroom compatibility documentation (ISO Class 1-3)
• Avoid 'HVAC valve' declarations that trigger 8415.xx classifications