Pneumatic Regulator for Semiconductor Slurry Delivery Systems from Japan
Pneumatic fluid power pressure regulator for chemical mechanical planarization (CMP) slurry lines, maintaining consistent abrasive slurry pressure to polishing pads during wafer planarization. Classified under HTS 8481.10.00.60 as other pneumatic pressure-reducing valves for semiconductor processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Use abrasion-resistant carbide or ceramic trim materials; provide particle size compatibility certification for sub-100nm slurries; ensure diaphragm material resistance to alkaline slurries