Pneumatic Regulator for Semiconductor Slurry Delivery Systems from China
Pneumatic fluid power pressure regulator for chemical mechanical planarization (CMP) slurry lines, maintaining consistent abrasive slurry pressure to polishing pads during wafer planarization. Classified under HTS 8481.10.00.60 as other pneumatic pressure-reducing valves for semiconductor processing.
Duty Rate — China → United States
39.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Use abrasion-resistant carbide or ceramic trim materials; provide particle size compatibility certification for sub-100nm slurries; ensure diaphragm material resistance to alkaline slurries