Pneumatic Pressure Reducing Valve for Semiconductor Wafer Etch Systems from Germany
This pneumatic fluid power pressure-reducing valve precisely controls gas pressure in semiconductor wafer etching chambers, ensuring uniform plasma distribution during fabrication. Classified under HTS 8481.10.00.60 as a pneumatic type pressure-reducing valve, other, used in high-purity semiconductor processing equipment. It maintains stable inlet pressures for reactive gases like CF4 or SF6.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify valve materials for ultra-high purity (UHP) semiconductor gas service; provide end-use documentation for semiconductor manufacturing to qualify for duty relief programs; ensure particle-free cleaning certification to meet fab standards