Pneumatic Pressure Reducing Valve for Semiconductor Wafer Etch Systems from China
This pneumatic fluid power pressure-reducing valve precisely controls gas pressure in semiconductor wafer etching chambers, ensuring uniform plasma distribution during fabrication. Classified under HTS 8481.10.00.60 as a pneumatic type pressure-reducing valve, other, used in high-purity semiconductor processing equipment. It maintains stable inlet pressures for reactive gases like CF4 or SF6.
Duty Rate — China → United States
37%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Certify valve materials for ultra-high purity (UHP) semiconductor gas service; provide end-use documentation for semiconductor manufacturing to qualify for duty relief programs; ensure particle-free cleaning certification to meet fab standards