Pneumatic Gas Pressure Regulator for CVD Semiconductor Deposition from Japan
Pneumatic pressure-reducing valve designed for chemical vapor deposition (CVD) systems in semiconductor production, regulating precursor gas pressures for thin film deposition on silicon wafers. Falls under HTS 8481.10.00.60 as other pneumatic fluid power pressure-reducing valves essential for maintaining process stability in wafer fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Verify compatibility with toxic precursor gases (TEOS, silane); include material safety data sheets (MSDS) for hazardous gas certification; confirm leak rate specifications below 10^-9 atm-cc/sec for semiconductor cleanrooms