Pneumatic Gas Pressure Regulator for CVD Semiconductor Deposition from China
Pneumatic pressure-reducing valve designed for chemical vapor deposition (CVD) systems in semiconductor production, regulating precursor gas pressures for thin film deposition on silicon wafers. Falls under HTS 8481.10.00.60 as other pneumatic fluid power pressure-reducing valves essential for maintaining process stability in wafer fabrication.
Duty Rate — China → United States
37%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Verify compatibility with toxic precursor gases (TEOS, silane); include material safety data sheets (MSDS) for hazardous gas certification; confirm leak rate specifications below 10^-9 atm-cc/sec for semiconductor cleanrooms