Plastic Semiconductor Wafer Carrier Mold from Japan
High-precision mold for injection molding static-dissipative plastic wafer carriers used in semiconductor handling. Falls under HTS 8480.79.9090 as other plastic molds, with tolerances under 0.01mm for cleanroom compatibility. Features anti-static mold release coatings.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Reference statistical notes for semiconductor equipment; prove mold makes handling carriers, not processing wafers directly
• Include cleanroom certification (ISO 14644) and ESD test data in import documentation
• Classify based on principal use; wafer transport carriers vs. fab processing molds affects chapter placement