Plastic Semiconductor Wafer Carrier Mold from Japan
High-precision mold for injection molding static-dissipative plastic wafer carriers used in semiconductor handling. Falls under HTS 8480.79.9090 as other plastic molds, with tolerances under 0.01mm for cleanroom compatibility. Features anti-static mold release coatings.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Reference statistical notes for semiconductor equipment; prove mold makes handling carriers, not processing wafers directly
• Include cleanroom certification (ISO 14644) and ESD test data in import documentation
• Classify based on principal use; wafer transport carriers vs. fab processing molds affects chapter placement