Plastic Semiconductor Wafer Carrier Mold from Japan
High-precision mold for injection molding static-dissipative plastic wafer carriers used in semiconductor handling. Falls under HTS 8480.79.9090 as other plastic molds, with tolerances under 0.01mm for cleanroom compatibility. Features anti-static mold release coatings.
Duty Rate — Japan → United States
13.1%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Reference statistical notes for semiconductor equipment; prove mold makes handling carriers, not processing wafers directly
• Include cleanroom certification (ISO 14644) and ESD test data in import documentation
• Classify based on principal use; wafer transport carriers vs. fab processing molds affects chapter placement