Plastic Semiconductor Wafer Carrier Mold from China
High-precision mold for injection molding static-dissipative plastic wafer carriers used in semiconductor handling. Falls under HTS 8480.79.9090 as other plastic molds, with tolerances under 0.01mm for cleanroom compatibility. Features anti-static mold release coatings.
Duty Rate — China → United States
38.1%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Reference statistical notes for semiconductor equipment; prove mold makes handling carriers, not processing wafers directly
• Include cleanroom certification (ISO 14644) and ESD test data in import documentation
• Classify based on principal use; wafer transport carriers vs. fab processing molds affects chapter placement