Consumer Electronics Phone Case Injection Mold from Japan
Multi-cavity injection mold for polycarbonate smartphone protective cases, optimized for thin-wall molding and logo texturing. HTS 8480.71.8020 applies when temporarily imported for prototype testing, calibration of gate locations, examination of release agents, or repair of hot runner systems, with export required post-servicing. Supports rapid iteration in consumer electronics manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document mold trials with injection parameter logs and sample part photos as proof of 'testing' activity
• For calibration imports, provide pre/post measurement reports from accredited labs to satisfy CBP verification