8480.30.00.00/Wafer Slicing Saw Calibration Pattern/Mexico

Wafer Slicing Saw Calibration Pattern from Mexico

Diamond-patterned test piece for calibrating wafer slicing saws from semiconductor boules, per statistical note (a)(ii)(B). Falls under HTS 8480.30.00.00 as specialized molding pattern for semiconductor equipment.

Duty Rate — Mexico → United States

12.8%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document kerf loss specs and boule slicing process linkage

• Declare as consumable calibration tool, not blade replacement

Wafer Slicing Saw Calibration Pattern from Mexico — Import Duty Rate | HTS 8480.30.00.00